Minimizing Thermal Conductivity for Boosting Thermoelectric Properties of Cu–Ni-Based Alloys through All-Scale Hierarchical Architectures-Reference-Cited by-同舟云学术

Minimizing Thermal Conductivity for Boosting Thermoelectric Properties of Cu–Ni-Based Alloys through All-Scale Hierarchical Architectures

Published:2021-04-23 Issue:5 Volume:4 Page:5015-5023
ISSN:2574-0962
Container-title:ACS Applied Energy Materials
language:en
Short-container-title:ACS Appl. Energy Mater.

Author:

Guo Kai¹^ORCID,Zhang Jiarong¹,Zhang Yuting¹,Liu Lu²,Yuan Song¹,Jiang Ying²,Luo Jun¹²^ORCID,Zhao Jing-Tai³⁴

Affiliation:

1. School of Materials Science and Engineering, Shanghai University, 99 Shangda Road, Shanghai 200444, China

2. Materials Genome Institute, Shanghai University, 99 Shangda Road, Shanghai 200444, China

3. School of Materials Science and Engineering, Guilin University of Electronic Technology, Guilin 541004, China

4. Guangxi Key Laboratory of Information Materials, Guilin University of Electronic Technology, Guilin 541004, China

Funder

National Natural Science Foundation of China

Programme of Introducting Talents of Discipline to Universities

National Key Research and Development Program of China

Publisher

American Chemical Society (ACS)

Subject

Electrical and Electronic Engineering,Materials Chemistry,Electrochemistry,Energy Engineering and Power Technology,Chemical Engineering (miscellaneous)

Link

https://pubs.acs.org/doi/pdf/10.1021/acsaem.1c00559

Reference31 articles.

1. Low-cost, abundant binary sulfides as promising thermoelectric materials

2. Cu-based thermoelectric materials

3. Recent advances in high-performance bulk thermoelectric materials

4. Suppressing the dynamic precipitation and lowering the thermal conductivity for stable and high thermoelectric performance in BaCu2Te2 based materials

5. Review of current high-ZT thermoelectric materials

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