A Rapid and Facile Soft Contact Lamination Method: Evaluation of Polymer Semiconductors for Stretchable Transistors-Reference-Cited by-同舟云学术

A Rapid and Facile Soft Contact Lamination Method: Evaluation of Polymer Semiconductors for Stretchable Transistors

Published:2014-07-22 Issue:15 Volume:26 Page:4544-4551
ISSN:0897-4756
Container-title:Chemistry of Materials
language:en
Short-container-title:Chem. Mater.

Author:

Wu Hung-Chin¹²,Benight Stephanie J.¹,Chortos Alex³,Lee Wen-Ya¹,Mei Jianguo¹,To John W. F.¹,Lu Chien¹,He Mingqian⁴,Tok Jeffery B.-H.¹,Chen Wen-Chang²,Bao Zhenan¹³

Affiliation:

1. Department of Chemical Engineering, Stanford University, Stanford, California 94305, United States

2. Department of Chemical Engineering, National Taiwan University, Taipei 10617, Taiwan

3. Materials Science and Engineering, Stanford University, Stanford, California 94305, United States

4. Corning Incorporated, Corning, New York 14831, United States

Publisher

American Chemical Society (ACS)

Subject

Materials Chemistry,General Chemical Engineering,General Chemistry

Link

https://pubs.acs.org/doi/pdf/10.1021/cm502271j

Reference48 articles.

1. Materials and Mechanics for Stretchable Electronics

2. Stretchable, Large-area Organic Electronics

3. Stretchable and self-healing polymers and devices for electronic skin

4. 25th Anniversary Article: The Evolution of Electronic Skin (E-Skin): A Brief History, Design Considerations, and Recent Progress

5. 25th Anniversary Article: A Soft Future: From Robots and Sensor Skin to Energy Harvesters

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