Super Strong and Multi-Reusable Supramolecular Epoxy Hot Melt Adhesives
Author:
Affiliation:
1. Key Laboratory of Organic Optoelectronics & Molecular Engineering, Department of Chemistry, Tsinghua University, Beijing 100084, China
Funder
National Natural Science Foundation of China
Publisher
American Chemical Society (ACS)
Subject
General Materials Science,Biomedical Engineering,General Chemical Engineering
Link
https://pubs.acs.org/doi/pdf/10.1021/acsmaterialslett.1c00277
Reference60 articles.
1. Development of environmentally friendly warm-melt adhesives for the packaging industry
2. Current Research and Development Status and Prospect of Hot-Melt Adhesives: A Review
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4. Supramolecular adhesive materials from small‐molecule self‐assembly
5. Supramolecular polymer for enhancement of adhesion and processability of hot melt polyamides
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