Ultrahigh Energy-Dissipation Thermal Interface Materials through Anneal-Induced Disentanglement-Reference-Cited by-同舟云学术

Ultrahigh Energy-Dissipation Thermal Interface Materials through Anneal-Induced Disentanglement

Published:2022-04-07 Issue:5 Volume:4 Page:874-881
ISSN:2639-4979
Container-title:ACS Materials Letters
language:en
Short-container-title:ACS Materials Lett.

Author:

Zeng Xiangliang¹^ORCID,Zeng Xiaoliang²^ORCID,Fan Jianfeng²,Li Junwei²^ORCID,Wang Zhenyu²,Sun Rong²^ORCID,Ren Linlin²,Xia Xinnian¹

Affiliation:

1. College of Chemistry and Chemical Engineering, Hunan University, Lushan South Road, Yuelu District, Changsha 410082, China

2. Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China

Funder

Youth Innovation Promotion Association of the Chinese Academy of Sciences

National Natural Science Foundation of China

Shenzhen Science and Technology Research Funding

Guangdong Basic and Applied Basic Research Funding

Guangdong Province

Guangdong Provincial Key Laboratory

Publisher

American Chemical Society (ACS)

Subject

General Materials Science,Biomedical Engineering,General Chemical Engineering

Link

https://pubs.acs.org/doi/pdf/10.1021/acsmaterialslett.2c00132

Reference40 articles.

1. The chips are down for Moore’s law

2. Emerging challenges and materials for thermal management of electronics

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4. A Combination of Boron Nitride Nanotubes and Cellulose Nanofibers for the Preparation of a Nanocomposite with High Thermal Conductivity

5. An Anisotropically High Thermal Conductive Boron Nitride/Epoxy Composite Based on Nacre‐Mimetic 3D Network

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