2D High-Temperature Superconductor Integration in Contact Printed Circuit Boards

Author:

Saggau Christian N.1ORCID,Shokri Sanaz12,Martini Mickey12,Confalone Tommaso12,Lee Yejin12,Wolf Daniel1ORCID,Gu Genda3,Brosco Valentina45,Montemurro Domenico6,Vinokur Valerii M.78,Nielsch Kornelius129,Poccia Nicola1ORCID

Affiliation:

1. Leibniz Institute for Solid State and Materials Science Dresden (IFW Dresden), 01069 Dresden, Germany

2. Institute of Applied Physics, Technische Universität Dresden, 01062 Dresden, Germany

3. Condensed Matter Physics and Materials Science Department, Brookhaven National Laboratory, Upton, New York 11973, United States

4. Istituto dei Sistemi Complessi (ISC-CNR) and Dipartimento di Fisica, Universita, Sapienza, P.le A. Moro, 2, I-00185 Rome, Italy

5. Centro Ricerche Enrico Fermi, Piazza del Viminale, 1, I-00184 Rome, Italy

6. Department of Physics, University of Naples Federico II, 80125 Naples, Italy

7. Terra Quantum AG, CH-9000 St. Gallen, Switzerland

8. Physics Department, CUNY, City College of City University of New York, 160 Convent Ave, New York, New York 10031, United States

9. Institute of Materials Science, Technische Universität Dresden, 01062 Dresden, Germany

Funder

U.S. Department of Energy

Deutsche Forschungsgemeinschaft

National Science Foundation

Terra Quantum AG

Piano Nazionale di Ripresa e Resilienza (PNRR) Ministero dell'Universit?? e della Ricerca (MUR)

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

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