Enhancing Interfacial Stability and Mechanical Strength of a CoSb3-Based Thermoelectric Junction Using Ti-Based Alloy Barrier Layers
Author:
Affiliation:
1. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China
Funder
National Key Research and Development Program of China
National Natural Science Foundation of China
Publisher
American Chemical Society (ACS)
Subject
General Materials Science
Link
https://pubs.acs.org/doi/pdf/10.1021/acsami.3c14591
Reference34 articles.
1. Enhanced Thermoelectric Performance of Yb-Single-Filled Skutterudite by Ultralow Thermal Conductivity
2. Thermoelectric Materials for Space and Automotive Power Generation
3. Generic Approach for Contacting Thermoelectric Solid Solutions: Case Study in n- and p-Type Mg2Si0.3Sn0.7
4. Electrode interface optimization advances conversion efficiency and stability of thermoelectric devices
5. Interface and Surface Engineering Realized High Efficiency of 13% and Improved Thermal Stability in Mg 3 Sb 1.5 Bi 0.5 ‐Based Thermoelectric Generation Devices
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