Adhesion Characterization and Enhancement between Polyimide-Silica Composite and Nodulated Copper for Applications in Next-Generation Microelectronics-Reference-Cited by-同舟云学术

Adhesion Characterization and Enhancement between Polyimide-Silica Composite and Nodulated Copper for Applications in Next-Generation Microelectronics

Published:2024-01-04 Issue:2 Volume:16 Page:2692-2703
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Doshi Sagar M.¹^ORCID,Barry Alexander¹,Schneider Alexander¹²,Parambil Nithin¹,Mulzer Catherine³,Yahyazadehfar Mobin³,Samadi-Dooki Aref³,Foltz Benjamin³,Warrington Keith³,Wessel Richard³,Zhang Lei³,Simone Christopher³,Blackman Gregory S.³,Lamontia Mark A.³,Gillespie John W.¹²⁴⁵

Affiliation:

1. Center for Composite Materials, University of Delaware, Newark, Delaware 19716, United States

2. Department of Mechanical Engineering, University of Delaware, Newark, Delaware 19716, United States

3. DuPont Specialty Products USA LLC, Wilmington, Delaware 19803, United States

4. Department of Materials Science and Engineering, University of Delaware, Newark, Delaware 19716, United States

5. Department of Civil and Environmental Engineering, University of Delaware, Newark, Delaware 19716, United States

Funder

DuPont

Publisher

American Chemical Society (ACS)

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.3c14434

Reference24 articles.

1. Adhesion of polyimides to metal and ceramic surfaces: an overview

2. Adhesion and interface studies between copper and polyimide

3. Surface modification with special morphology for the metallization of polyimide film

4. Adhesion interaction between electrolessly deposited copper film and polyimide

5. Electroless copper plating using dimethylamine borane as reductant

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