Mold Embossing-Based Soft Lithography for Fabrication of Complex Non-rectangular Channels
Author:
Affiliation:
1. School of Mechanical Engineering, Suzhou University of Science and Technology, Suzhou, Jiangsu 215009, China
2. Hengtong New Energy Electrical Technology Co., Ltd., Suzhou 215234, China
Funder
Suzhou City Industry Foresight and Key-Core Technology Project
Publisher
American Chemical Society (ACS)
Subject
General Materials Science
Link
https://pubs.acs.org/doi/pdf/10.1021/acsami.3c01306
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