Ultralow Coefficient of Thermal Expansion and a High Colorless Transparent Polyimide Film Realized Through a Reinforced Hydrogen-Bond Network by In Situ Polymerization of Aromatic Polyamide in Colorless Polyimide-Reference-Cited by-同舟云学术

Ultralow Coefficient of Thermal Expansion and a High Colorless Transparent Polyimide Film Realized Through a Reinforced Hydrogen-Bond Network by In Situ Polymerization of Aromatic Polyamide in Colorless Polyimide

Published:2023-08-24 Issue:35 Volume:15 Page:41793-41805
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Jiang Xueshuang¹,Chen Kaijin¹,Li Chuying¹,Long Yubo¹,Liu Siwei¹,Chi Zhenguo¹^ORCID,Xu Jiarui¹,Zhang Yi¹^ORCID

Affiliation:

1. PCFM Lab, GD HPPC Lab, Guangdong Engineering Technology Research Centre for High-Performance Organic and Polymer Photoelectric Functional Films, State Key Laboratory of Optoelectronic Materials and Technologies, School of Chemistry, Sun Yat-sen University, Guangzhou510275, China

Funder

Guangdong Science and Technology Department

Ministry of Science and Technology of the People's Republic of China

China Postdoctoral Science Foundation

National Natural Science Foundation of China

Science and Technology Department of Guangxi Zhuang Autonomous

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.3c05664