Strain- and Defect-Mediated Thermal Conductivity in Silicon Nanowires
Author:
Affiliation:
1. Department of Materials Science and Engineering and ‡Department of Mechanical Engineering and Applied Mechanics, University of Pennsylvania, Philadelphia, Pennsylvania 19104, United States
Funder
U.S. Department of Energy
Publisher
American Chemical Society (ACS)
Subject
Mechanical Engineering,Condensed Matter Physics,General Materials Science,General Chemistry,Bioengineering
Link
https://pubs.acs.org/doi/pdf/10.1021/nl500840d
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