Impedance and Morphological Properties of Electroless Gold on Industrial Metal Coupons
Author:
Affiliation:
1. Department of Chemistry, State University of New York at Binghamton, Binghamton New York 13902-6016
Publisher
American Chemical Society (ACS)
Subject
Electrochemistry,Spectroscopy,Surfaces and Interfaces,Condensed Matter Physics,General Materials Science
Link
https://pubs.acs.org/doi/pdf/10.1021/la001267e
Reference41 articles.
1. Konsowski, S. G., Helland, A. R., Eds. Electronic Packaging of High-Speed Circuitry; McGraw-Hill: New York, 1997; p 64.
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