Novel surface segregation phenomena at the plasma/copper-silver alloy interface-Reference-Cited by-同舟云学术

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Novel surface segregation phenomena at the plasma/copper-silver alloy interface

Published:1993-09-01 Issue:9 Volume:5 Page:1221-1226
ISSN:0897-4756
Container-title:Chemistry of Materials
language:en
Short-container-title:Chem. Mater.

Author:

Knight J. M.,Fonseca J. L. C.,Hauptman Z. V.,Badyal J. P. S.

Publisher

American Chemical Society (ACS)

Subject

Materials Chemistry,General Chemical Engineering,General Chemistry

Link

https://pubs.acs.org/doi/pdf/10.1021/cm00033a007

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Regulating the electronic structure of plasmonic Co/Cu catalysts through morphology engineering to enhance visible-light-driven hydrogen generation from aqueous ammonia borane;Catalysis Science & Technology;2023

2. Silver–Copper Nanoalloy Catalyst Layer for Bifunctional Air Electrodes in Alkaline Media;ACS Applied Materials & Interfaces;2015-08-04

3. Fabrication of Cu-Ag Interconnection Using Electrodeposition: The Mechanism of Superfilling and the Properties of Cu-Ag Film;Journal of The Electrochemical Society;2013

4. In Situ Transmission Electron Microscopy Observation of Silver Oxidation in Ionized/Atomic Gas;Langmuir;2011-10-28

5. Additive-Gas Effects on Cl[sub 2] Plasma-Based Copper-Etch Process and Sidewall Attack;Journal of The Electrochemical Society;2008

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