Labile Cd Complexes Increase Cd Availability to Plants
Author:
Affiliation:
1. Laboratory for Soil and Water Management, K.U. Leuven, Kasteelpark Arenberg 20, 3001 Heverlee, Belgium
Publisher
American Chemical Society (ACS)
Subject
Environmental Chemistry,General Chemistry
Link
https://pubs.acs.org/doi/pdf/10.1021/es050894t
Reference32 articles.
1. Trace metals in humic and fulvic acids from Lake Ontario sediments
2. Biotic ligand model of the acute toxicity of metals. 1. Technical Basis
3. A Biotic Ligand Model Predicting Acute Copper Toxicity for Daphnia magna: The Effects of Calcium, Magnesium, Sodium, Potassium, and pH
4. BIOAVAILABILITY OF CADMIUM AND ZINC TO THE COMMON CARP, CYPRINUS CARPIO, IN COMPLEXING ENVIRONMENTS: A TEST FOR THE VALIDITY OF THE FREE ION ACTIVITY MODEL
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