Electroplating of Amorphous Thin Films of Tungsten/Nickel Alloys-Reference-Cited by-同舟云学术

Electroplating of Amorphous Thin Films of Tungsten/Nickel Alloys

Published:2001-12-01 Issue:26 Volume:17 Page:8270-8275
ISSN:0743-7463
Container-title:Langmuir
language:en
Short-container-title:Langmuir

Author:

Younes O.¹,Zhu L.¹,Rosenberg Y.¹,Shacham-Diamand Y.¹,Gileadi E.¹

Affiliation:

1. School of Chemistry, Faculty of Exact Sciences; Department of Physical Electronics, Faculty of Engineering; and Wolfson Applied Materials Research Center, Tel-Aviv University, Ramat-Aviv, Israel

Publisher

American Chemical Society (ACS)

Subject

Electrochemistry,Spectroscopy,Surfaces and Interfaces,Condensed Matter Physics,General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/la010660x

Reference25 articles.

1. Non-crystalline Structure in Solidified Gold–Silicon Alloys

2. Phase evolution in electrodeposited Ni-W-B alloy

3. Okinaka, Y.; Osaka,T. InAdvances in Electrochemical Science andEngineering; Gerischer, H., Tobias, C. W., Eds.; VCH Publ: New York, 1994; pp 57−116.

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