Thermally Evaporated SiO Thin Films As a Versatile Interlayer for Plasma-Based OLED Passivation-Reference-Cited by-同舟云学术

Thermally Evaporated SiO Thin Films As a Versatile Interlayer for Plasma-Based OLED Passivation

Published:2012-06-08 Issue:6 Volume:4 Page:3247-3253
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Yun Won Min¹,Jang Jaeyoung¹,Nam Sooji¹,Kim Lae Ho¹,Seo Sang Joon²,Park Chan Eon¹

Affiliation:

1. POSTECH Organic Electronics Laboratory, Polymer Research Institute, Department of Chemical Engineering, Pohang University of Science and Technology, Pohang, 790-784, Korea.

2. SKKU Advanced Institute of Nanotechnology (SAINT) and Center for Human Interface Nanotechnology (HINT), Sungkyunkwan University, Suwon 440-746, Republic of Korea.

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/am300600s

Reference23 articles.

1. Organic electroluminescent diodes

2. Improving the performance of doped π-conjugated polymers for use in organic light-emitting diodes

3. Light-emitting diodes based on conjugated polymers

4. Reliability and degradation of organic light emitting devices

Cited by 35 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. High-performance water vapor barriers via amorphous alumina-polycrystalline zinc oxide hybrids with a self-wrinkling morphology;Surface and Coatings Technology;2022-10

2. Two-Dimensional Stacked Composites of Self-Assembled Alkane Layers and Graphene for Transparent Gas Barrier Films with Low Permeability;Nano Letters;2022-01-03

3. Rapid-deposited high-performance submicron encapsulation film with in-situ plasma oxidized Al layer inserted;Applied Physics Express;2021-12-20

4. Material innovation and mechanics design for substrates and encapsulation of flexible electronics: a review;Materials Horizons;2021

5. High moisture-resistive MoOx/metal/graphite barrier films with excellent thermal dissipation for the encapsulation of organic electronics;Organic Electronics;2020-11