Interfacial Adhesive Properties between a Rigid-Rod Pyromellitimide Molecular Layer and a Covalent Semiconductor via Atomistic Simulations-Reference-Cited by-同舟云学术

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Interfacial Adhesive Properties between a Rigid-Rod Pyromellitimide Molecular Layer and a Covalent Semiconductor via Atomistic Simulations

Published:2013-05-14 Issue:11 Volume:5 Page:4702-4711
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Makeev Maxim A.¹,Geubelle Philippe H.²,Sottos Nancy R.³,Kieffer John¹

Affiliation:

1. Department of Materials Science and Engineering, University of Michigan, Ann Arbor, Michigan 48109, United States

2. Department of Aerospace Engineering, University of Illinois at Urbana−Champaign, Urbana, Illinois 61801, United States

3. Department of Materials Science and Engineering, University of Illinois at Urbana−Champaign, Urbana 61801, Illinois, United States

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/am3031163

Reference66 articles.

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