Stoichiometric Self-Assembly of Isomeric, Shape-Persistent, Supramacromolecular Bowtie and Butterfly Structures
Author:
Affiliation:
1. Department of Polymer Science and ‡Department of Chemistry, The University of Akron, Akron, Ohio 44325, United States
Publisher
American Chemical Society (ACS)
Subject
Colloid and Surface Chemistry,Biochemistry,General Chemistry,Catalysis
Link
https://pubs.acs.org/doi/pdf/10.1021/ja303177v
Reference41 articles.
1. Metallo‐Controlled Dynamic Molecular Tweezers: Design, Synthesis, and Self‐Assembly by Metal‐Ion Coordination
2. Supramolecular Chemistry
3. Coordination Assemblies from a Pd(II)-Cornered Square Complex
4. Self-Assembled M 24 L 48 Polyhedra and Their Sharp Structural Switch upon Subtle Ligand Variation
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