Improvement of Thermal Conductivities for Epoxy Composites via Incorporating Poly(vinyl benzal)-Coated h-BN Fillers and Solvent-Assisted Dispersion-Reference-Cited by-同舟云学术

Improvement of Thermal Conductivities for Epoxy Composites via Incorporating Poly(vinyl benzal)-Coated h-BN Fillers and Solvent-Assisted Dispersion

Published:2019-09-13 Issue:40 Volume:58 Page:18635-18643
ISSN:0888-5885
Container-title:Industrial & Engineering Chemistry Research
language:en
Short-container-title:Ind. Eng. Chem. Res.

Author:

Yang Fanghong¹²,Sun Xiaopeng¹²,Guo Qiyang¹,Yao Zhanhai¹²^ORCID

Affiliation:

1. State Key Laboratory of Polymer Physics and Chemistry, Changchun Institute of Applied Chemistry, Chinese Academy of Sciences, Changchun 130022, PR China

2. University of Science and Technology of China, Hefei, Anhui 230026, PR China

Funder

Ministry of Science and Technology of the People's Republic of China

National Natural Science Foundation of China

Publisher

American Chemical Society (ACS)

Subject

Industrial and Manufacturing Engineering,General Chemical Engineering,General Chemistry

Link

https://pubs.acs.org/doi/pdf/10.1021/acs.iecr.9b03861

Reference51 articles.

1. Emerging challenges and materials for thermal management of electronics

2. A review of dielectric polymer composites with high thermal conductivity

3. Thermally conductive composite films of hexagonal boron nitride and polyimide with affinity-enhanced interfaces

4. Very high thermal conductivity obtained by boron nitride-filled polybenzoxazine

5. Thermal conductivity of polymer-based composites: Fundamentals and applications

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