110th Anniversary: Design of Cooling Fluids for Electronic Equipment-Reference-Cited by-同舟云学术

110th Anniversary: Design of Cooling Fluids for Electronic Equipment

Published:2019-03-01 Issue:12 Volume:58 Page:4925-4935
ISSN:0888-5885
Container-title:Industrial & Engineering Chemistry Research
language:en
Short-container-title:Ind. Eng. Chem. Res.

Author:

Sun Yijia¹,Samudra Apurva²,Sahinidis Nikolaos V.¹^ORCID

Affiliation:

1. Department of Chemical Engineering, Carnegie Mellon University, Pittsburgh, United States

2. Facebook, Menlo Park, California, United States

Publisher

American Chemical Society (ACS)

Subject

Industrial and Manufacturing Engineering,General Chemical Engineering,General Chemistry

Link

https://pubs.acs.org/doi/pdf/10.1021/acs.iecr.8b06378

Reference66 articles.

1. Chips 2020

2. Thermal management technologies market analysis and segment forecasts to 2024; Grand View Research: 2016; https://www.grandviewresearch.com/industry-analysis/thermal-management-technologies-industry.

3. A Review of High-Heat-Flux Heat Removal Technologies

4. A critical review of traditional and emerging techniques and fluids for electronics cooling

5. Montreal Protocol on Substances that Deplete the Ozone Layer. https://www.state.gov/e/oes/eqt/chemicalpollution/83007.htm, Montreal, 16 September, 1987.

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