Broadband Metallic Fiber-to-Chip Couplers and a Low-Complexity Integrated Plasmonic Platform
Author:
Affiliation:
1. ETH Zurich, Institute of Electromagnetic Fields (IEF), 8092 Zürich, Switzerland
2. Polariton Technologies AG, 8803 Rüschlikon, Switzerland
3. University of Washington, Department of Chemistry, Seattle, Washington 98195-1700, United States
Funder
Air Force Office of Scientific Research
H2020 Future and Emerging Technologies
H2020 Industrial Leadership
H2020 European Research Council
Publisher
American Chemical Society (ACS)
Subject
Mechanical Engineering,Condensed Matter Physics,General Materials Science,General Chemistry,Bioengineering
Link
https://pubs.acs.org/doi/pdf/10.1021/acs.nanolett.0c05069
Reference60 articles.
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