Ultrafast Three-Dimensional Integrated Imaging of Strain in Core/Shell Semiconductor/Metal Nanostructures-Reference-Cited by-同舟云学术

Ultrafast Three-Dimensional Integrated Imaging of Strain in Core/Shell Semiconductor/Metal Nanostructures

Published:2017-11-07 Issue:12 Volume:17 Page:7696-7701
ISSN:1530-6984
Container-title:Nano Letters
language:en
Short-container-title:Nano Lett.

Author:

Cherukara Mathew J.¹^ORCID,Sasikumar Kiran²,DiChiara Anthony¹,Leake Steven J.³,Cha Wonsuk¹,Dufresne Eric M.¹,Peterka Tom⁴,McNulty Ian²,Walko Donald A.¹,Wen Haidan¹,Sankaranarayanan Subramanian K. R. S.²^ORCID,Harder Ross J.¹

Affiliation:

1. Advanced Photon Source, Argonne National Laboratory, Argonne, Illinois 60439, United States

2. Center for Nanoscale Materials, Argonne National Laboratory, Argonne, Illinois 60439, United States

3. ESRF − The European Synchrotron, 71 Avenue des Martyrs, 38000 Grenoble, France

4. Mathematics and Computer Science, Argonne National Laboratory, Argonne, Illinois 60439, United States

Funder

Laboratory Directed Research and Development

Argonne National Laboratory

Publisher

American Chemical Society (ACS)

Subject

Mechanical Engineering,Condensed Matter Physics,General Materials Science,General Chemistry,Bioengineering

Link

https://pubs.acs.org/doi/pdf/10.1021/acs.nanolett.7b03823

Reference33 articles.

1. Metal–insulator–semiconductor optoelectronic fibres

2. Catalysis with TiO2/Gold Nanocomposites. Effect of Metal Particle Size on the Fermi Level Equilibration

3. An electrodeposited inhomogeneous metal–insulator–semiconductor junction for efficient photoelectrochemical water oxidation

4. Supersensitive, Fast-Response Nanowire Sensors by Using Schottky Contacts

5. Strain-Mediated Interfacial Dynamics during Au–PbS Core–Shell Nanostructure Formation

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