1. Center for Joining and Electronic Packaging, State Key Laboratory of Material Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, People’s Republic of China
2. Shenzhen R&D Center of Huazhong University of Science and Technology, Shenzhen 518000, People’s Republic of China
3. School of Physics and Wuhan National High Magnetic Field Center, Huazhong University of Science and Technology, Wuhan, 430074, People’s Republic of China