Heat Flow Guiding and Modulation by Kinks in a Silicon Nanoribbon
Author:
Affiliation:
1. Department of Advanced Manufacturing and Robotics, College of Engineering, Peking University, Beijing 100871, People’s Republic of China
2. Department of Mechanical Engineering, Vanderbilt University, Nashville, Tennessee 37235, United States
Funder
Peking University
Publisher
American Chemical Society (ACS)
Subject
Mechanical Engineering,Condensed Matter Physics,General Materials Science,General Chemistry,Bioengineering
Link
https://pubs.acs.org/doi/pdf/10.1021/acs.nanolett.3c01795
Reference46 articles.
1. Colloquium: Phononics: Manipulating heat flow with electronic analogs and beyond
2. Transforming heat transfer with thermal metamaterials and devices
3. Transient heat flux shielding using thermal metamaterials
4. Full Control and Manipulation of Heat Signatures: Cloaking, Camouflage and Thermal Metamaterials
5. Structured thermal surface for radiative camouflage
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