Fabrication of Copper Patterns on Flexible Substrate by Patterning–Adsorption–Plating Process
Author:
Affiliation:
1. Department of Materials Science, Fudan University, Shanghai, P.R. China
Publisher
American Chemical Society (ACS)
Subject
General Materials Science
Link
https://pubs.acs.org/doi/pdf/10.1021/am405539r
Reference39 articles.
1. Liquid Ink Jet Printing with MOD Inks for Hybrid Microcircuits
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