Al2O3 and TiO2 Atomic Layer Deposition on Copper for Water Corrosion Resistance-Reference-Cited by-同舟云学术

Al2O3 and TiO2 Atomic Layer Deposition on Copper for Water Corrosion Resistance

Published:2011-11-16 Issue:12 Volume:3 Page:4593-4601
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Abdulagatov A. I.¹,Yan Y.¹,Cooper J. R.¹,Zhang Y.¹,Gibbs Z. M.¹,Cavanagh A. S.¹,Yang R. G.¹,Lee Y. C.¹,George S. M.¹

Affiliation:

1. Department of Chemistry and Biochemistry, ‡Department of Mechanical Engineering, §Department of Chemical and Biological Engineering, ⊥Department of Physics, and #DARPA Center for Integrated Micro/Nano-Electromechanical Transducers (iMINT), University of Colorado, Boulder, Colorado 80309-0215, United States

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/am2009579

Reference54 articles.

1. The corrosion behaviour of copper in neutral tap water. Part II: Determination of corrosion rates

2. The corrosion behaviour of copper in neutral tap water. Part I: Corrosion mechanisms

3. Atomistic insights into aqueous corrosion of copper

4. Effect of Specific Water Quality Parameters on Copper Corrosion

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