Carbon Foams by Solid State Foaming of Short Vermicelli Bonded by Phenol-Formaldehyde for Thermal Insulation and Electromagnetic Interference Shielding
Author:
Affiliation:
1. Department of Chemistry, Indian Institute of Space Science and Technology, Thiruvananthapuram 695 547, Kerala, India
Funder
University Grants Commission
Publisher
American Chemical Society (ACS)
Link
https://pubs.acs.org/doi/pdf/10.1021/acsaenm.2c00067
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