Accurate Ab Initio Quantum Mechanics Simulations of Bi2Se3 and Bi2Te3 Topological Insulator Surfaces
Author:
Affiliation:
1. Materials and Process Simulation Center, MC139-74, California Institute of Technology, Pasadena, California 91125, United States
Funder
Division of Chemistry
Division of Materials Research
Publisher
American Chemical Society (ACS)
Subject
General Materials Science,Physical and Theoretical Chemistry
Link
http://pubs.acs.org/doi/pdf/10.1021/acs.jpclett.5b01586
Reference34 articles.
1. Colloquium: Topological insulators
2. Topological insulators and superconductors
3. Experimental Realization of a Three-Dimensional Topological Insulator, Bi 2 Te 3
4. Observation of a large-gap topological-insulator class with a single Dirac cone on the surface
5. Electron correlation in semiconductors and insulators: Band gaps and quasiparticle energies
Cited by 44 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Properties of bismuth based Bi2A3 (A = S, Se, Te) chalcogenides for optoelectronic and thermoelectric applications;Solid State Communications;2024-12
2. Odd–Even Alkyl Chain Effects on the Structure and Charge Carrier Transport of Two-Dimensional Sn-Based Perovskite Semiconductors;Journal of the American Chemical Society;2024-07-02
3. Dispersion corrected elastic, electronic and thermoelectric properties of Bi2Se3;Computational Materials Science;2024-05
4. Topological Phase Transition in Non-centrosymmetric LiCaBi Compound: A First-principles Study;The Journal of Physical Chemistry C;2024-04-25
5. Transferable equivariant graph neural networks for the Hamiltonians of molecules and solids;npj Computational Materials;2023-10-06
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3