Induced Chemical Networking of Organometallic Tin in a Cyclic Framework for Sub-10 nm Patterning and Interconnect Application-Reference-Cited by-同舟云学术

Induced Chemical Networking of Organometallic Tin in a Cyclic Framework for Sub-10 nm Patterning and Interconnect Application

Published:2023-03-02 Issue:6 Volume:6 Page:4132-4140
ISSN:2574-0970
Container-title:ACS Applied Nano Materials
language:en
Short-container-title:ACS Appl. Nano Mater.

Author:

Nandi Santu¹^ORCID,Khillare Lalit¹,Kumar Sunil¹^ORCID,Moinuddin Mohamad G.²,Chauhan Manvendra²,Choudhary Sumit²^ORCID,Sharma Satinder K.²^ORCID,Ghosh Subrata¹^ORCID,Gonsalves Kenneth E.³

Affiliation:

1. School of Chemical Sciences, Indian Institute of Technology, Mandi, H.P. 175005, India

2. School Computing and Electrical Engineering, Indian Institute of Technology, Mandi, H.P. 175005, India

3. School of Basic Sciences, Indian Institute of Technology, Mandi, H.P. 175005, India

Funder

Council of Scientific and Industrial Research, India

Uchchatar Avishkar Yojana

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsanm.2c04831

Reference64 articles.

1. Clean BN-Encapsulated 2D FETs with Lithography-Compatible Contacts

2. Ultraflat Sub-10 Nanometer Gap Electrodes for Two-Dimensional Optoelectronic Devices

3. Review of metal-containing resists in electron beam lithography: perspectives for extreme ultraviolet patterning

4. Extreme ultraviolet resist materials for sub-7 nm patterning

5. New Generation Electron Beam Resists: A Review

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