Exploring the Water-Soluble Phosphine Ligand as the Environmentally Friendly Stabilizer for Electroless Nickel Plating-Reference-Cited by-同舟云学术

Exploring the Water-Soluble Phosphine Ligand as the Environmentally Friendly Stabilizer for Electroless Nickel Plating

Published:2009-01-21 Issue:4 Volume:48 Page:1727-1734
ISSN:0888-5885
Container-title:Industrial & Engineering Chemistry Research
language:en
Short-container-title:Ind. Eng. Chem. Res.

Author:

Wang Ke¹,Hong Liang¹,Liu Zhao-Lin¹

Affiliation:

1. Department of Chemical and Biomolecular Engineering, National University of Singapore, BLK E5 02-02, 4 Engineering Drive 4, Singapore 117576, and Institute of Materials Research & Engineering, 3 Research Link, Singapore 117602

Publisher

American Chemical Society (ACS)

Subject

Industrial and Manufacturing Engineering,General Chemical Engineering,General Chemistry

Link

https://pubs.acs.org/doi/pdf/10.1021/ie801456f

Reference43 articles.

1. A study on the influence of process parameters on efficiency and crystallinity of electroless Ni–P deposits

2. Modeling the stability of electroless plating bath—diffusion of nickel colloidal particles from the plating frontier

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