Modeling of the Kinetics in Copper Chemical Vapor Deposition from Cu(hfac)VTMS-Reference-Cited by-同舟云学术

Modeling of the Kinetics in Copper Chemical Vapor Deposition from Cu(hfac)VTMS

Published:1999-11-09 Issue:12 Volume:11 Page:3470-3475
ISSN:0897-4756
Container-title:Chemistry of Materials
language:en
Short-container-title:Chem. Mater.

Author:

ter Heerdt M. L. H.¹,Overdijk J. J.¹,van der Put P. J.¹,Schoonman J.¹

Affiliation:

1. Laboratory for Inorganic Chemistry, Delft University of Technology, Julianalaan 136, 2628 BL Delft, The Netherlands

Publisher

American Chemical Society (ACS)

Subject

Materials Chemistry,General Chemical Engineering,General Chemistry

Link

https://pubs.acs.org/doi/pdf/10.1021/cm991017n

Reference33 articles.

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2. Griffin, G. L.; Maverick, A. W. InThe Chemistry of Metal CVD; Kodas, T. T., Hampden-Smith, M. J., Eds.; VCH: Weinheim, 1994; p 175.

3. Hampden-Smith, M. J.; Kodas, T. T. InThe Chemistry of Metal CVD; Kodas, T. T., Hampden-Smith, M. J., Eds.; VCH: Weinheim, 1994; p 239.

4. Toward a Unified Reaction Mechanism for Chemical Vapor Deposition of Copper

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