Study on Thermomechanical Properties and Morphology of an Epoxy Resin Thermally Conductive Adhesive under Different Curing Conditions-Reference-Cited by-同舟云学术

Study on Thermomechanical Properties and Morphology of an Epoxy Resin Thermally Conductive Adhesive under Different Curing Conditions

Author:

Zhang Cheng¹,Xu Zhe¹,Huang Yingxuan¹,Li Yuefeng¹,Li Yang²,Yang Bobo¹^ORCID,Hu Rongrong¹,Zou Jun¹^ORCID,Zheng Changran³,Qian Qi⁴

Affiliation:

1. School of Science, Shanghai Institute of Technology, Shanghai 201418, China

2. School of Materials Science and Engineering, Shanghai Institute of Technology, Shanghai 201418, China

3. Academy for Engineering and Technology, Fudan University, Shanghai 200433, China

4. Zhejiang Silanex Technology (Taizhou) Co., Ltd., No 318, Yongyuan Road, Lunan Street, Luqiao District, Taizhou, Zhejiang 318050, China

Funder

Chinese Polar Environment Comprehensive Investigation and Assessment Programmes

Jiangsu Provincial Key Research and Development Program

Science and Technology Commission of Shanghai Municipality

National Natural Science Foundation of China

Shanghai Chenguang Program

Science and Technology Talent Development Fund for Young and Middle-aged Teachers of Shanghai Institute of Technology

Haining Municipal Science and Technology Project

Publisher

American Chemical Society (ACS)

Link

Reference58 articles.

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