A Dual-Cure, Solid-State Photoresist Combining a Thermoreversible Diels–Alder Network and a Chain Growth Acrylate Network
Author:
Affiliation:
1. Department of Chemical and Biological Engineering, University of Colorado, UCB 596, Boulder, Colorado 80309, United States
Funder
National Science Foundation
Publisher
American Chemical Society (ACS)
Subject
Materials Chemistry,Inorganic Chemistry,Polymers and Plastics,Organic Chemistry
Link
https://pubs.acs.org/doi/pdf/10.1021/ma500244r
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