Reducing the Coefficient of Thermal Expansion of Polyimide Films in Microelectronics Processing Using ZnS Particles at Low Concentrations-Reference-Cited by-同舟云学术

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Reducing the Coefficient of Thermal Expansion of Polyimide Films in Microelectronics Processing Using ZnS Particles at Low Concentrations

Published:2018-02-07 Issue:3 Volume:1 Page:1076-1082
ISSN:2574-0970
Container-title:ACS Applied Nano Materials
language:en
Short-container-title:ACS Appl. Nano Mater.

Author:

Jeon Hyungjoon¹,Yoon Cheolsang¹,Song Young-Geon¹,Han Junwon²,Kwon Sujin²,Kim Seungwon²,Chang Insu³,Lee Kangtaek¹^ORCID

Affiliation:

1. Department of Chemical and Biomolecular Engineering, Yonsei University, Seoul 03722, Republic of Korea

2. Material Development P/J, Semiconductor R&D Center, Samsung Electronics, Hwaseong-si, Gyeonggi-do 18448, Republic of Korea

3. Radiation Safety Management Division, Korea Atomic Energy Research Institute, Yuseong-gu, Daejeon 34057, Republic of Korea

Funder

Samsung

National Research Foundation of Korea

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsanm.7b00259

Reference37 articles.

1. Modeling of the mechanical properties of nanoparticle/polymer composites

2. Synthesis and dynamic mechanical behaviour of inorganic–organic hybrids containing various inorganic components

3. Heat dissipation properties of polyimide nanocomposite films

4. Highly transparent polyimide hybrids for optoelectronic applications

5. Spontaneous molecular orientation of polyimides induced by thermal imidization (6). Mechanism of negative in-plane CTE generation in non-stretched polyimide films

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4. Thermo-Viscoelastic residual stress behavior of fluorinated polyimide based on fluid Instability-Driven shear exfoliated graphenic nanosheet;Chemical Engineering Journal;2023-01

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