On the Influence of Surfactant Incorporation during Electroless Nickel Plating
Author:
Affiliation:
1. School of Engineering and the Built Environment, Edinburgh Napier University, EH10 5DT, U.K.
Publisher
American Chemical Society (ACS)
Subject
Industrial and Manufacturing Engineering,General Chemical Engineering,General Chemistry
Link
https://pubs.acs.org/doi/pdf/10.1021/ie202625n
Reference102 articles.
1. Brenner, A.; Riddel, G.Nickel plating by chemical reduction. U.S. Patent 2,532,282, 1950.
2. J. Res. Natl. Bur. Stand. 1946, 37, 1.
3. Properties of electroless nickel
4. Electroless alloy/composite coatings: A review
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