Low-Resistivity Titanium Nitride Thin Films Fabricated by Atomic Layer Deposition with TiCl<sub>4</sub> and Metal–Organic Precursors in Horizontal Vias-Reference-Cited by-同舟云学术

Low-Resistivity Titanium Nitride Thin Films Fabricated by Atomic Layer Deposition with TiCl₄ and Metal–Organic Precursors in Horizontal Vias

Published:2023-07-18 Issue:8 Volume:5 Page:4094-4102
ISSN:2637-6113
Container-title:ACS Applied Electronic Materials
language:en
Short-container-title:ACS Appl. Electron. Mater.

Author:

Kuo Cheng-Hsuan¹^ORCID,Mcleod Aaron J.²^ORCID,Lee Ping-Che¹,Huang James¹^ORCID,Kashyap Harshil¹^ORCID,Wang Victor¹^ORCID,Yun SeongUK²^ORCID,Zhang Zichen¹^ORCID,Spiegelman Jeffrey³,Kanjolia Ravindra⁴,Moinpour Mansour⁴,Kummel Andrew C.²^ORCID

Affiliation:

1. Materials Science and Engineering Program, University of California, 9500 Gilman Drive La Jolla, San Diego, California 92093, United States

2. Department of Chemistry and Biochemistry, University of California, 9500 Gilman Drive La Jolla, San Diego, California 92093, United States

3. Rasirc, San Diego, California 92093, United States

4. EMD Electronics, 6533 Nancy Ridge Dr, San Diego, California 92121, United States

Funder

Semiconductor Research Corporation

Publisher

American Chemical Society (ACS)

Subject

Materials Chemistry,Electrochemistry,Electronic, Optical and Magnetic Materials

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