Multiferroic Self-Assembled BaTiO3–Fe Vertically Aligned Nanocomposites on Mica Substrates toward Flexible Electronics
Author:
Affiliation:
1. School of Materials Engineering, Purdue University, West Lafayette, Indiana 47907, United States
2. School of Electrical and Computer Engineering, Purdue University, West Lafayette, Indiana 47907, United States
Funder
Basic Energy Sciences
Publisher
American Chemical Society (ACS)
Subject
Materials Chemistry,Electrochemistry,Electronic, Optical and Magnetic Materials
Link
https://pubs.acs.org/doi/pdf/10.1021/acsaelm.2c00712
Reference52 articles.
1. Scalable energy-efficient magnetoelectric spin–orbit logic
2. Advances in magnetoelectric multiferroics
3. Integrated Magnetics and Multiferroics for Compact and Power-Efficient Sensing, Memory, Power, RF, and Microwave Electronics
4. Recent Progress in Multiferroic Magnetoelectric Composites: from Bulk to Thin Films
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