High-Throughput Wafer-Scale Wrinkle Patterning: a Single-Step Fabrication Process and Applications for Tunable Optical Transmittance-Reference-Cited by-同舟云学术

High-Throughput Wafer-Scale Wrinkle Patterning: a Single-Step Fabrication Process and Applications for Tunable Optical Transmittance

Published:2021-07-15 Issue:7 Volume:3 Page:3200-3206
ISSN:2637-6113
Container-title:ACS Applied Electronic Materials
language:en
Short-container-title:ACS Appl. Electron. Mater.

Author:

Chang Bingdong¹^ORCID,Zhao Ding²^ORCID,Sun Hongyu³^ORCID

Affiliation:

1. DTU Nanolab, Technical University of Denmark, Ørsteds Plads, Building 347, 2800 Kgs. Lyngby, Denmark

2. Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, 18 Shilongshan Road, Hangzhou, 310024 Zhejiang Province, China

3. DENSsolutions B. V., Informaticalaan 12, 2628 ZD Delft, The Netherlands

Funder

China Postdoctoral Science Foundation

Villum Fonden

Publisher

American Chemical Society (ACS)

Subject

Materials Chemistry,Electrochemistry,Electronic, Optical and Magnetic Materials

Link

https://pubs.acs.org/doi/pdf/10.1021/acsaelm.1c00380

Reference25 articles.

1. Surface Wrinkles for Smart Adhesion

2. Friction of soft elastomeric wrinkled surfaces

3. Wrinkles and deep folds as photonic structures in photovoltaics

4. Fabricating Microlens Arrays by Surface Wrinkling

5. Stretchable Organic Solar Cells

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