Carbon Nanotube Interconnects Realized through Functionalization and Sintered Silver Attachment-Reference-Cited by-同舟云学术

Carbon Nanotube Interconnects Realized through Functionalization and Sintered Silver Attachment

Published:2016-02-16 Issue:8 Volume:8 Page:5563-5570
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Gopee V.¹²,Thomas O.¹,Hunt C.¹,Stolojan V.²,Allam J.²,Silva S. R. P.²

Affiliation:

1. National Physical Laboratory, Hampton Road, Teddington TW11 0LW, United Kingdom

2. Advanced Technology Institute, University of Surrey, Guildford GU2 7XH, United Kingdom

Funder

Engineering and Physical Sciences Research Council

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.5b12057

Reference48 articles.

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2. Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection

3. Lu, G. Q.; Calata, J. N.; Lei, G. Y.; Chen, X.Low-Temperature and Pressureless Sintering Technology for High-Performance and High-Temperature Interconnection of Semiconductor Devices;IEEE:New York, 2007; pp609–613.

4. Thermal behavior of silver nanoparticles for low-temperature interconnect applications

5. Reliability and current carrying capacity of carbon nanotubes

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