Theoretical Study on Polyimide−Cu(100)/Ni(100) Adhesion
Author:
Affiliation:
1. Institute of High Performance Computing, 1 Science Park Road, #01-01 The Capricorn, Singapore 117528, and Department of Chemistry, National University of Singapore, 3 Science Drive 3, Singapore 117543
Publisher
American Chemical Society (ACS)
Subject
Materials Chemistry,General Chemical Engineering,General Chemistry
Link
https://pubs.acs.org/doi/pdf/10.1021/cm052865n
Reference33 articles.
1. Ghosh, M. K.; Mittal, K. L.Polyimides: fundamentals andapplications; Marcel Dekker: New York, 1996.
2. Low dielectric constant polymers for microelectronics
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