Simple Electrochemical Method for Deposition and Voltammetric Inspection of Silver Particles at the Liquid−Liquid Interface of a Thin-Film Electrode-Reference-Cited by-同舟云学术

Simple Electrochemical Method for Deposition and Voltammetric Inspection of Silver Particles at the Liquid−Liquid Interface of a Thin-Film Electrode

Published:2006-01-26 Issue:6 Volume:110 Page:2812-2820
ISSN:1520-6106
Container-title:The Journal of Physical Chemistry B
language:en
Short-container-title:J. Phys. Chem. B

Author:

Mirčeski Valentin¹,Gulaboski Rubin¹

Affiliation:

1. Institute of Chemistry, Faculty of Natural Sciences and Mathematics, Sts. Cyril and Methodius University, P.O. Box 162, 1000 Skopje, Republic of Macedonia, and REQUIMTE Departamento de Quimica, Faculdade de Ciencias, Universidade do Porto, Rua do Campo Alegre 687, Porto, Portugal

Publisher

American Chemical Society (ACS)

Subject

Materials Chemistry,Surfaces, Coatings and Films,Physical and Theoretical Chemistry

Link

https://pubs.acs.org/doi/pdf/10.1021/jp056627r

Reference39 articles.

1. Lahtinen, R.; Jensen, H.; Fermin, D. J. InInterfacial Catalysis; Volkov, A. G., Ed.; Marcel Dekker: New York, 2003; pp 611−633.

2. Novel silver metal liquidlike films

3. Benzene- and Anthracene-Mediated Assembly of Gold Nanoparticles at the Liquid−Liquid Interface

4. Electroless Deposition of Palladium at Bare and Templated Liquid/Liquid Interfaces

5. Reversible Voltage-Induced Assembly of Au Nanoparticles at Liquid|Liquid Interfaces

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