Effects of Chemistry of Silicon Surfaces on the Curing Process and Adhesive Strength for Epoxy Resin
Author:
Affiliation:
1. Center for Polymer Interface and Molecular Adhesion Science, Kyushu University, Fukuoka 819-0395, Japan
2. Dassault Systèmes K. K., Tokyo 141-6020, Japan
3. Department of Applied Chemistry, Kyushu University, Fukuoka 819-0395, Japan
Funder
Japan Science and Technology Agency
Publisher
American Chemical Society (ACS)
Subject
Organic Chemistry,Polymers and Plastics,Process Chemistry and Technology
Link
https://pubs.acs.org/doi/pdf/10.1021/acsapm.2c00855
Reference61 articles.
1. Epoxy resins as anticorrosive polymeric materials: A review
2. Toughening of Petroleum Based (DGEBA) Epoxy Resins with Various Renewable Resources Based Flexible Chains for High Performance Applications: A Review
3. Epoxy Polymer Networks with Improved Thermal and Mechanical Properties via Controlled Dispersion of Reactive Toughening Agents
4. Synthesis and application of epoxy resins: A review
5. Viscoelastic relaxation attributed to the molecular dynamics of polyrotaxane confined in an epoxy resin network
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