Thermally Responsive Imidazole-Based Diels–Alder Microbeads as a Latent Curing Agent for Epoxy Resins-Reference-Cited by-同舟云学术

Thermally Responsive Imidazole-Based Diels–Alder Microbeads as a Latent Curing Agent for Epoxy Resins

Published:2022-07-27 Issue:8 Volume:4 Page:6111-6119
ISSN:2637-6105
Container-title:ACS Applied Polymer Materials
language:en
Short-container-title:ACS Appl. Polym. Mater.

Author:

Jung Sungmin¹,Kim Yoon Sang¹,Jang Han Gyeol¹,Park Jong Hyuk²^ORCID,Park Min¹,Choi Yong-Seok¹,Kim Jaewoo¹²^ORCID

Affiliation:

1. Institute of Advanced Composite Materials, Korea Institute of Science and Technology (KIST), 92 Chudong-ro, Bongdong-eup, Wanju-gun, Jeonbuk 55324, Korea

2. Convergence Research Center for Solutions to Electromagnetic Interference in Future-mobility, Korea Institute of Science and Technology (KIST), 5, Hwarang-ro 14-gil, Seongbuk-gu, Seoul 02792, Korea

Funder

National Research Council of Science and Technology

Ministry of Trade, Industry and Energy

Publisher

American Chemical Society (ACS)

Subject

Organic Chemistry,Polymers and Plastics,Process Chemistry and Technology

Link

https://pubs.acs.org/doi/pdf/10.1021/acsapm.2c00916

Reference31 articles.

1. Nanofilled epoxy adhesive for structural aeronautic materials

2. Multifunctionality in Epoxy Resins

3. Curing of DGEBA epoxy using a phenol-terminated hyperbranched curing agent: Cure kinetics, gelation, and the TTT cure diagram

4. Synthesis of Biobased Flame-Retardant Carboxylic Acid Curing Agent and Application in Wood Surface Coating

5. Dynamic Curing Agents for Amine-Hardened Epoxy Vitrimers with Short (Re)processing Times

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