Effect of Surface Nanostructures and Speciation on Undercooling for Low-Temperature Solder Alloys-Reference-Cited by-同舟云学术

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Effect of Surface Nanostructures and Speciation on Undercooling for Low-Temperature Solder Alloys

Published:2022-02-24 Issue:3 Volume:5 Page:3325-3332
ISSN:2574-0970
Container-title:ACS Applied Nano Materials
language:en
Short-container-title:ACS Appl. Nano Mater.

Author:

Martin Andrew¹,Chang Boyce S.¹,Thuo Martin¹²³^ORCID

Affiliation:

1. Department of Materials Science and Engineering, Iowa State University, Ames, Iowa 50010, United Sates

2. Department of Electrical and Computer Engineering, Iowa State University, Ames, Iowa 50010, United Sates

3. Micro-Electronics Research Center, Ames, Iowa 50010, United Sates

Funder

Iowa State University

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsanm.1c03865

Reference62 articles.

1. Harnessing Hansen solubility parameters to predict organogel formation

2. Hansen, C. Hansen Solubility Parameters: A User’s Handbook; CRC Press: Ukraine, 2007; pp 1–26.

3. 50 Years with solubility parameters—past and future

4. Polymer additives and solubility parameters

5. A Flory–Huggins model based on the Hansen solubility parameters

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