Copper Deposition from Chloride-Containing Aqueous Solutions: Catalysis and the Role of the Water Structure-Reference-Cited by-同舟云学术

Copper Deposition from Chloride-Containing Aqueous Solutions: Catalysis and the Role of the Water Structure

Published:2021-01-14 Issue:3 Volume:125 Page:1811-1818
ISSN:1932-7447
Container-title:The Journal of Physical Chemistry C
language:en
Short-container-title:J. Phys. Chem. C

Author:

Colombo Estefanía¹,Belletti Gustavo D.¹,Fonseca Sarah²,Pinto Leandro M. C.²^ORCID,Juarez M. Fernanda³,Nazmutdinov Renat⁴,Santos Elizabeth³,Schmickler Wolfgang³^ORCID,Quaino Paola¹^ORCID

Affiliation:

1. Instituto de Química Aplicada del Litoral, IQAL (UNL-CONICET), Facultad de Ingeniería Química (UNL), 3000 Santa Fe, Argentina

2. Instituto de Química, Universidade Federal de Mato Grosso do Sul, UFMS, 79074-460 Campo Grande, MS, Brazil

3. Institute of Theoretical Chemistry, Ulm University, Ulm D-89069, Germany

4. Kazan National Research Technological University, 420015 Kazan, Republic of Tatarstan, Russian Federation

Funder

Bundesministerium für Bildung und Forschung

Universidad Nacional del Litoral

Consejo Nacional de Investigaciones Científicas y Técnicas

Deutsche Forschungsgemeinschaft

Russian Foundation for Basic Research

Conselho Nacional de Desenvolvimento Científico e Tecnológico

Agencia Santafesina de Ciencia, Tecnología e Innovación

Ministerio de Ciencia, Tecnología e Innovación Productiva

Publisher

American Chemical Society (ACS)

Subject

Surfaces, Coatings and Films,Physical and Theoretical Chemistry,General Energy,Electronic, Optical and Magnetic Materials

Link

https://pubs.acs.org/doi/pdf/10.1021/acs.jpcc.0c08825

Reference25 articles.

1. In-situ video-STM studies of Cu electrodeposition on Cu(100) in HCl solution

2. The enigma of metal deposition

3. Why Silver Deposition is so Fast: Solving the Enigma of Metal Deposition

4. On the Electrochemical Deposition and Dissolution of Divalent Metal Ions

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Theoretical and experimental research on electroplating additives in chip metal interconnects;SCIENTIA SINICA Chimica;2023-08-25

2. Fundamentals of interface science for electronically electroplated in chip manufacturing: a review of the 341<sup>st</sup> “shuangqing forum”;SCIENTIA SINICA Chimica;2023-08-23

3. Influence of suppressing additive malachite green on superconformal cobalt electrodeposition;Journal of Electroanalytical Chemistry;2022-09

4. Complex single‐molecule and molecular scale entities in electrochemical environments: Mechanisms and challenges;Electrochemical Science Advances;2021-11-08