Chemical Bond Formation and Rupture Processes: An Application of DFT–Chemical Pressure Approach-Reference-Cited by-同舟云学术

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Chemical Bond Formation and Rupture Processes: An Application of DFT–Chemical Pressure Approach

Published:2018-08-23 Issue:37 Volume:122 Page:21216-21225
ISSN:1932-7447
Container-title:The Journal of Physical Chemistry C
language:en
Short-container-title:J. Phys. Chem. C

Author:

Osman Hussien H.¹²³^ORCID,Andrés Juan²^ORCID,Salvadó Miguel A.¹,Recio J. Manuel¹^ORCID

Affiliation:

1. MALTA-Consolider Team and Departamento de Química Física y Analítica, Universidad de Oviedo, E-33006 Oviedo, Spain

2. Department of Physical and Analytical Chemistry, UJI—Universität Jaume I, Av. de Vicent Sos Baynat, s/n, Castelló de la Plana 12071, Spain

3. Department of Chemistry, Faculty of Science, Helwan University, Ain-Helwan, 11795 Cairo, Egypt

Funder

Generalitat Valenciana

Universitat Jaume I

European Regional Development Fund

Ministerio de Econom?a y Competitividad

Publisher

American Chemical Society (ACS)

Subject

Surfaces, Coatings and Films,Physical and Theoretical Chemistry,General Energy,Electronic, Optical and Magnetic Materials

Link

https://pubs.acs.org/doi/pdf/10.1021/acs.jpcc.8b06947

Reference61 articles.

1. The Chemical Bond

2. The Physical Origin of Covalent Bonding

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