Direct Writing on Copper Ion Doped Silica Films by Electrogeneration of Metallic Microstructures-Reference-Cited by-同舟云学术

Direct Writing on Copper Ion Doped Silica Films by Electrogeneration of Metallic Microstructures

Published:2017-01-05 Issue:2 Volume:121 Page:1129-1139
ISSN:1932-7447
Container-title:The Journal of Physical Chemistry C
language:en
Short-container-title:J. Phys. Chem. C

Author:

Kandory Ahmed¹,Cattey Hélène²,Saviot Lucien³^ORCID,Gharbi Tijani¹,Vigneron Jackie⁴,Frégnaux Mathieu⁴,Etcheberry Arnaud⁴,Herlem Guillaume¹^ORCID

Affiliation:

1. Laboratoire de NanoMedécine, Imagerie et Thérapeutique EA 4662, UFR Sciences & Techniques, CHU J. Minjoz, Université de Bourgogne Franche-Comté, 16 route de Gray, 25030 Besançon, Cedex, France

2. Institut de Chimie Moléculaire, UMR-CNRS 6302, Université de Bourgogne Franche-Comté, 9 avenue A. Savary, 21078 Dijon, Cedex, France

3. Laboratoire Interdisciplinaire Carnot de Bourgogne, UMR 6303, CNRS−Université de Bourgogne Franche-Comté, 9 avenue A. Savary, BP 47870, F-21078 Dijon, Cedex, France

4. UMR CNRS 8180, Institut Lavoisier, 45 av. Des Etats-Unis, 78035 Versailles, Cedex, France

Funder

Campus France

Ministry of Higher Education and Scientific Research

Ministère de l'Enseignement Supérieur et de la Recherche

Cultural Burea, Embassy of the Republic of Iraq in Paris - France

Publisher

American Chemical Society (ACS)

Subject

Surfaces, Coatings and Films,Physical and Theoretical Chemistry,General Energy,Electronic, Optical and Magnetic Materials

Link

http://pubs.acs.org/doi/pdf/10.1021/acs.jpcc.6b09913