Molecular Modeling of Interfaces between Hole Transport and Active Layers in Flexible Organic Electronic Devices-Reference-Cited by-同舟云学术

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Molecular Modeling of Interfaces between Hole Transport and Active Layers in Flexible Organic Electronic Devices

Published:2015-12-03 Issue:50 Volume:119 Page:27909-27918
ISSN:1932-7447
Container-title:The Journal of Physical Chemistry C
language:en
Short-container-title:J. Phys. Chem. C

Author:

Bhowmik Rahul¹²,Berry Rajiv J.¹,Varshney Vikas¹³,Durstock Michael F.¹,Leever Benjamin J.¹

Affiliation:

1. Materials and Manufacturing Directorate, Air Force Research Laboratory, Wright-Patterson Air Force Base, Ohio 45433, United States

2. UES Inc., 4401 Dayton-Xenia Road, Dayton, Ohio 45432, United States

3. Universal Technology Corporation, 1270 North Fairfield Road, Dayton, Ohio 45432, United States

Funder

Air Force Research Laboratory

Publisher

American Chemical Society (ACS)

Subject

Surfaces, Coatings and Films,Physical and Theoretical Chemistry,General Energy,Electronic, Optical and Magnetic Materials

Link

https://pubs.acs.org/doi/pdf/10.1021/acs.jpcc.5b09765

Reference88 articles.

1. Organic materials for printed electronics

2. Low power, high impact

3. Self-assembly is ready to roll

4. Organic electronics on paper

5. Flexible organic electronic devices: Materials, process and applications

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