Correlation of Bulk Modulus and the Constituent Element Properties of Binary Intermetallic Compounds
Author:
Affiliation:
1. Institute of High Performance Computing of Singapore, 89C Science Park Drive, #02-11/12 The Rutherford Singapore Science Park 1, Singapore 118261, Singapore
Publisher
American Chemical Society (ACS)
Subject
Materials Chemistry,General Chemical Engineering,General Chemistry
Link
https://pubs.acs.org/doi/pdf/10.1021/cm0104203
Reference28 articles.
1. Intermetallic Compounds for High-Temperature Structural Use
2. Elastic Properties of High-Temperature Intermetallics
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4. Material characteristics and thermal stability of cosputtered Ta–Ru thin films
5. Characterization of hafnium diboride thin film resistors by r.f. magnetron sputtering
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