A Quantum Chemistry Based Force Field for Poly(dimethylsiloxane)
Author:
Affiliation:
1. Department of Material Science and Engineering and Department of Chemical Engineering, University of Utah, 122 South Central Campus Drive Room 304, Salt Lake City, Utah 84112
Publisher
American Chemical Society (ACS)
Subject
Materials Chemistry,Surfaces, Coatings and Films,Physical and Theoretical Chemistry
Link
https://pubs.acs.org/doi/pdf/10.1021/jp047434r
Reference43 articles.
1. Comparisons among the reinforcing effects provided by various silica-based fillers in a siloxane elastomer
2. Reinforcement of siloxane elastomers by silica. Chemical interactions between an oligomer of poly(dimethylsiloxane) and a fumed silica
3. The Molecular Structure of Disiloxane, (SiH3)2O.
4. Far Infrared Spectrum and Structure of Disiloxane
Cited by 53 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Molecular Dynamics Simulation of Silicone Oil Polymerization from Combined QM/MM Modeling;Polymers;2024-06-20
2. Surface hydrophobization of hydrogels via interface dynamics-induced network reconfiguration;Nature Communications;2024-01-03
3. In Situ Monitoring of Block Copolymer Self-Assembly via Solvent Exchange through Controlled Dialysis with Light and Neutron Scattering Detection;ACS Macro Letters;2023-09-06
4. Investigating Solvent-Induced Aggregation in Edge-Functionalized Layered Silicates via All-Atom Molecular Dynamics Simulations;The Journal of Physical Chemistry B;2023-09-06
5. Thermal conductivity and mechanical properties of thermally conductive composites based on multifunctional epoxyorganosiloxanes and hexagonal boron nitride;Ceramics International;2022-09
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3