New Insights into Evaluation of Kinetic Parameters for Potentiostatic Metal Deposition with Underpotential and Overpotential Deposition Processes
Author:
Affiliation:
1. Departamento de Materiales, Universidad Autónoma Metropolitana-Azcapotzalco, A.P. 16-306, C.P. 02000 México, D.F., México
2. Departamento de Química, Universidad Autónoma Metropolitana-Iztapalapa, A.P. 55-534, 09340 México, D.F., México
Publisher
American Chemical Society (ACS)
Subject
Materials Chemistry,Surfaces, Coatings and Films,Physical and Theoretical Chemistry
Link
https://pubs.acs.org/doi/pdf/10.1021/jp9931861
Reference74 articles.
1. The influence of anions on the structure of underpotentially deposited Cu on Au(111): A LEED, RHEED and AES study
2. Atomic structure of Cu adlayers on Au(100) and Au(111) electrodes observed byin situscanning tunneling microscopy
3. Atomic structure of ordered copper adlayers on single-crystalline gold electrodes
4. Atomic-Resolution Electrochemistry with the Atomic Force Microscope: Copper Deposition on Gold
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